- AMD: B550, X570
- Intel: Z390, Z490, Z590
- micro SD 15.0(L) x 11.0(W) x 1.0(H) mm
- SD Adapter 32.0(L) x 24.0(W) x 2.1(H) mm
- Windows 10 / 8.1 / 8 / 7 / Vista, MAC OS 10.4 or later, Linux 2.6
- Windows 10 / 8.1 / 8 / 7 / Vista, MAC OS 10.4 or later, Linux 2.6.33
3D QLC, SLC Caching
A redefinition of everything by outstanding performance
Advanced SLC Caching technology
CL / Speed: 19-19-19-43
CL / Speed: 22-22-22-52
Compatibility: Intel: 600 series, 700 series
Compatibility: Intel: 700 series
Data Transfer Bandwidth: 21,328 MB/s (PC4 21300)
Data Transfer Bandwidth: 21,328 MB/s (PC4 31000)
Data Transfer Bandwidth: 44,800 MB/s
Data Transfer Bandwidth: 48,000 MB/s
Data Transfer Bandwidth: 51,200 MB/s
Data Transfer Rate 128 GB: Read speed up to 100MB/s
Data Transfer Rate 32 GB: Read speed up to 75MB/s
Data Transfer Rate 64 GB: Read speed up to 100MB/s
Data Transfer Rate: 16GB R/W: up to 80/15 MB/s
Data Transfer Rate: 32GB: up to 100/20 MB/s
Design for releasing unlimited creativity
Diemnsions: 60.3(L) x 18(W) x 4.6(H) mm
Dimensions:
Dimensions: 31.25(H) x 133.4(L) x 6.6(W)mm
Dimensions: 32 x 134 mm
Dimensions: 32 x 140 x 7 mm
Dimensions: 46.1(H) x 144.2(L) x 7(W)mm
Dimensions: 54.9(L) x 20.5(W) x 9.5(H) mm
Dimensions: 67.6 x 30 mm
Dożywotnia gwarancja prdocuetna
Dożywotnia gwarancja producenta
E2E Data Protection
Every recognition of memory overturned
exFAT format
High-Quality ICs Selected for Stability & Reliability
IC Specifications: x8
Kompatybilne z laptopami z procesorem Intel 13 generacji
Kompatybilne z platformami Intel oraz AMD
Kompatybilność:
Kompatybilność: Intel: 600 series,700 series
Latency: CL38-38-38-78
Latency: CL40-40-40-84
Latency: CL46-46-46-90
Latency: 30-36-36-76
Latency: CL18-18-18-43
LDPC Graphene Heat Dissipation Solution, Garbage Collection
LDPC, Garbage Collecion, E2E Data Protection
LDPC, Garbage Collection, Graphene Heat Dissipation Solution
LDPC, Graphene Heat Dissipation Solution, Garbage Collection
Lifetime warranty for maximum protection
M.2 PCIe Gen3.0 x4 with NVMe 1.3
M.2 PCIe Gen3.0 x4 with NVMe 1.3 - M key
MAC OS 10.4 or later
Maksymalna prędkość odczytu: 100 MB/s
Maksymalna prędkość odczytu: 75 MB/s
Module Type: 288 Pin Unbuffered DIMM Non ECC
Napięcie: DC+5V
Obsługiwane systemy: Windows 11/10/8/7/Vista, Linux 2.6.33 or later,
Obsługiwane systemy: Windows Vista/7/8/10/11; Linux 2.6.33+; macOS 10.4
Obsługiwane systemy: Windows Vista/7/8/8.1/10/11; Linux 2.6.33+
Obsługiwane systemy: Windows Vista/7/8/8.1/10/11; Linux 2.6.33+; macOS 10.4
Odpornośc na wstrząsy: 500 G
Odporność na wsrząsy: 1,500 G
Odporność na wstrząsy: 1500 G
Odporność na wstrząsy: 1500G/0,5ms
On-die ECC for Stable Systems
Operating System:
Operation Temperature: -25°C ~ 85°C
Operation Temperature: 0? ~ 70?
Opóźnienie: CL46-45-45-90
PCIe Gen4 x4 with NVMe 1.4
Power Management ICs (PMICs) Equipped for Stable, Efficient Power Usage
Random Read: 500IOPS, Random Write: 150IOPS
Read/Write: up to: 1,500/500 IOPS
Read/Write: up to: 90/45 MB/s
Reinforced Structure for Better Cooling
Reliable performance
Sleek Design
Storage Temperature: -40°C ~ 85°C
Strengthened PMIC Cooling Design
Support SLC Cache
Supports Intel XMP3.0 for One-Click Overclocking
Supports only products with SDHC logo or slots complying with SDHC
Supports only products with the Micro SDHC logo or slots complying with Mic
Temperatura pracy : -40°C ~ 85°C
Temperatura pracy: 0°C ~ 70°C
Temperatura przechowywania: -20°C ~ 85°C
Temperatura przechowywania: -40 ~ 85°C
Transfer danych: 44,800 MB/s
USB 3.2 Gen1 (3.0 / 3.1) transfer interface
Voltage: 2.7V ~ 3.6V
Voltage: DC+5V
Waga: 7g
Waga: 9 g
Wear Leveling
Weight: 1g
Weight: 9g
Windows TRIM optimization
Wspierane systemy: Windows XP lub wyżej, Mac OS 10.4+, Linux 2.6+
Wymiary: 100 x 69,9 x 7 mm
Wymiary: 100 x 69,9 x 7 mmm
Wymiary: 32 x 134 mm
Wymiary: 32 x 134 x 6,5 mm
Wymiary: 56 x 17,2 x 7,6 mm
Wymiary: 70 x 30 mm
Wymiary: 80 x 22 x 2,5 mm
Wymiary: 80 x 22 x 3,5 mm
Wymiary: 80 x 22 x 3,7 mm
Wymiary: 80 x 22 x 3,8 mm
Wymiary: 80 x 22 x 8,7 mm (z aluminiowym radiatorem)
Wymiary(GxSxW): 100 x 69.9 x 7 mm
